Papers about Bumping
by Dr. Chingchen S. Chiu, Dr. Ning-Cheng Lee
The solder bumping process for BGA is investigated by using solder paste alone, solder spheres with solder paste, and solder spheres with fluxes. Also explored is the use of InTEGRATED® preforms together with either flux or solder paste. For bumping process involving Sn62 or Sn63 spheres, use of paste for sphere attachment produces excellent alignment results. In the case of using fluxes for Sn62 or Sn63 sphere attachment, the defect rate increases with decreasing flux viscosity, decreasing solvent volatility, decreasing pitch dimension, increasing flux deposition thickness, increasing flux activity, and increasing pad diameter. For overall better yield, a solder paste with long stencil life, good printability, and good solder ball performance should be the most promising eutectic sphere attachment material. For systems using pastes for Sn10 sphere attachment, no missing is observed, and the alignment improves with decreasing paste deposition thickness, decreasing solvent volatility, increasing sphere solderability, increasing flux activity, increasing pad dimension, increasing metal load, increasing pad solderability. Paste viscosity, pitch, and reflow profile has negligible effect on the Sn10 bumping yield using Sn63 solder paste. An easily releasable solder paste is crucial for area-array BGA if a regular print-release process is desired for bumping with solder paste alone. Bumping with InTEGRATED® preforms is promising. Reducing the thickness and width of the solder link is considered essential for improving the bumping success rate. Other potential bumping processes may include (1) dispense paste/reflow, (2) print paste/reflow/release, (3) apply solder mask/print paste/release /reflow/strip solder mask, (4) solder jet/reflow, and (5) sphere welding, and are briefly introduced and commented on.
lead-free, balling, bump, Bumping, BGA, solder sphere, solder paste, integrated preforms, flux, defect rate, pb-free, solder
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Posted on 1 Jan 2009
by Dr. Benlih Huang, Dr. Ning-Cheng Lee
Several unique solder paste systems have been developed and tested for 63Sn/37Pb solder bumping for wafer, CSP, and BGA with the low cost print-detach-reflow process. The results indicate that the bump height achieved is very adequate and consistent for all three area array package systems. Microstructure of solder bumps appears normal. The yield is also very high for both before reflow and after reflow condition, and is dictated by printing performance. With the unique high slump resistance exhibited by those newly developed pastes, the paste transfer efficiency at printing stage becomes the most critical performance for this process. The transfer efficiency increases with increasing area ratio, increasing taper angle, decreasing pitch, decreasing stencil thickness, decreasing challenge, with adoption of square aperture design, and is not sensitive to aspect ratio of aperture to solder particle size. The paste systems appear to have more potential for depositing a larger amount of paste per unit pitch, as evidenced by the linear relation between expected paste volume and the deposited paste volume. Increasing metal content helps improving bumping performance. The bottleneck of increasing bumping performance for wafer applications appears to be developing a stencil manufacturing technology capable of providing an aperture pattern with spacing considerably smaller than the stencil thickness. Slow print speed is also essential for adequate printing. A non-shiny non-smooth stencil surface is considered beneficial for aiding paste rolling. The flux residue of those pastes is cleanable with solvents.
solder, soldering, area array package, Flip Chip, BGA, CSP, sphere, Bumping, paste, flux, fluxless, pb-free, lead-free
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Posted on 1 Jan 2009
by Dr. Ning-Cheng Lee
Spheres are manufactured via sequential flow/quench or reflow processes, then followed by degreasing and classification. Surface contamination or mis-handling can aggravate sphere solderability. Sphere attachment onto BGA typically is achieved via vacuum-transfer or gravity-dispensing processes, and the spheres are held in place by flux or solder paste before reflow. Welding process also in use. Bumping can be achieved via confined solder paste during reflow. Bumping with Sn62/Sn63 spheres & paste yields excellent results. Bumping with Sn62/Sn63 spheres & flux desires high viscosity, high volatility, large pitch, low print thickness, low flux activity, & small pads. Bumping with Sn10 sphere & paste exhibits no missing, and the yield increases with decreasing print thickness, decreasing volatility, increasing sphere solderability, increasing flux activity, increasing pad size, increasing metal load, & increasing pad solderability. The yield is not affected by viscosity, pitch, and reflow profile. For bumping with paste alone approach, easily releasable paste is crucial for regular print-release-reflow process. Bumping with integrated preform is promising. Reducing the thickness & width of solder links is essential for better yield.
solder, sphere, ball, BGA, Bumping, attachment, flux, solder paste, pb-free, lead-free
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Posted on 1 Jan 2009
by Dr. Ning-Cheng Lee , William Casey
Soldering is the primary interconnection technology for area array packages. Methods for solder bumping for area array packages can be categorized as follows: (1) build-up process, (2) liquid solder transfer, (3) solid solder transfer, and (4) solder paste bumping. The first group includes both evaporation and electroplating processes, while the second group includes meniscus bumping and solder jetting. The third group includes wire bumping, sphere welding, decal solder transfer, tacky dot solder transfer, integrated preform, and pick and-place solder transfer processes, with the last one (pick & place solder transfer) being the current prevailing option. Solder paste bumping exhibits great potential to reduce bumping costs dramatically, and includes the print-detach-reflow, print- reflow-detach, and dispense approaches. For an area array package attachment process, depending on the type of packaging, either flux, fluxless soldering or solder paste printing may be used as the attachment medium. Although area array packaging generally offers a robust process, attention should be paid to reduce defects such as delamination, misalignment, elongated joint, voiding, bridging, opens, cracking, poor wetting and various attachment interactions.
lead-free, pb-free, solder, soldering, area array package, Flip Chip, BGA, CSP, sphere, Bumping, paste, flux, fluxless
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Posted on 10 Mar 2010
