White Papers

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Papers about CHINESE LANGUAGE

• Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via MN or CE Doping (Chinese)

  by Jeffrey Chan, Scott Chen, Dr. Min Ding, Adriana Porras, Austin Huang, Anthony Gallagher, Dr. Weiping Liu, Dr. Ning-Cheng Lee

  Chinese version of Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via MN or CE Doping.

  CHINESE LANGUAGE, lead-free, Reliability, thermal cycling

  [Permanent Link to this Paper]

  Posted on 6 May 2011

• Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly (Chinese)

  by Mario Scalzo

  Chinese version of Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly.

  CHINESE LANGUAGE, halogen-free, head-in-pillow, pb-free, solder defects, solder paste, solder reliability, lead-free

  [Permanent Link to this Paper]

  Posted on 11 Mar 2010

• Availability of Indium and Gallium (Chinese)

  by Claire Mikolajczak, Bill Jackson

  Chinese version of Availability of Indium and Gallium

  CHINESE LANGUAGE, gallium extraction process, gallium mining, reclaiming ITO targets, indium refining capacities, tailings, slag, indium residues, indium, gallium, availability of indium and gallium, indium ores and mining, indium extraction

  [Permanent Link to this Paper]

  Posted on 22 May 2012

• Best Practices Reflow Profiling for Lead-Free SMT Assembly (Chinese)

  by Ed Briggs, Dr. Ronald C. Lasky

  Chinese version of Best Practices Reflow Profiling for Lead-Free SMT Assembly.

  CHINESE LANGUAGE, graping, head-in-pillow, Voids, solder balling, solder beading, tombstoning, reflow profile, solder defects

  [Permanent Link to this Paper]

  Posted on 22 Mar 2010

• Challenges of Implementing a Halogen-Free PCB Assembly Process (Chinese)

  by Timothy Jensen, Dr. Ronald C. Lasky

  Chinese version of Challenges of Implementing a Halogen-Free PCB Assembly Process.

  oxidation barrier, activator, pb-free, reflow, graping, head-in-pillow, halide-free, halogen-free, halogens, CHINESE LANGUAGE

  [Permanent Link to this Paper]

  Posted on 22 Mar 2010

• Fine Feature Stencil Printing 0.3MM Pitch Components (Chinese)

  by Ed Briggs, Dr. Ronald C. Lasky, Chris Anglin

  Chinese version of Fine Feature Stencil Printing 0.3MM Pitch Components

  CHINESE LANGUAGE, solder paste, stencil printing, miniaturization

  [Permanent Link to this Paper]

  Posted on 13 May 2011

• Full Metal TIMs (Chinese)

  by Ross B. Berntson, Bob Jarrett, Jordan Ross

  Chinese version of Full Metal TIMs.

  CHINESE LANGUAGE, TIM

  [Permanent Link to this Paper]

  Posted on 11 Mar 2010

• Head-in-Pillow: The Defect that Caught Us Napping (Chinese)

  by Timothy Jensen

  Chinese version of Head-In-Pillow: The Defect that Caught Us Napping.

  head-in-pillow, CHINESE LANGUAGE

  [Permanent Link to this Paper]

  Posted on 22 Mar 2010

• Solder Preform Basics (Chinese)

  by Paul Socha

  A chinese version of Solder Preform Basics.

  CHINESE LANGUAGE

  [Permanent Link to this Paper]

  Posted on 22 Mar 2010

• Soldering Challenges in a Halogen-Free PCB Assembly Process (Chinese)

  by Amanda Hartnett, Dr. Ronald C. Lasky, Timothy Jensen

  Chinese version of Soldering Challenges in a Halogen-Free PCB Assembly Process

  halogen-free, halide-free, solder, soldering, graping, flux, head-in-pillow, hole-fill, CHINESE LANGUAGE

  [Permanent Link to this Paper]

  Posted on 13 May 2011

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