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Papers about Dipping Flux

• Next Generation PoP Pastes for Electronics Assembly

  by Jim Hisert, Brandon Judd

  Package-on-package (PoP) technology allows two or more electronic components to be stacked vertically, which saves space and allows our portable gadgets to continue getting smaller year after year. A relatively new form of solder paste called "PoP Paste" has been developed specifically for this application.

  There are fundamental differences between PoP pastes and the traditional solder pastes, which are designed for printing applications. This paper will highlight the differences between these solder pastes and talk about the characteristics needed by PoP pastes to increase transfer efficiency, eliminate head-in-pillow defects, and provide excellent solder wetting. If these three criteria are met, solder joint reliability will follow.

  head-in-pillow, Dipping Flux, Dipping Paste, package on package, PoP Solder Paste, BGA

  [Permanent Link to this Paper]

  Posted on 15 Oct 2009

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