Papers about TIM
by Ross B. Berntson, Bob Jarrett , Jordan Ross
CHINESE LANGUAGE, TIM
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Posted on 11 Mar 2010
by Bob Jarrett , Jordan Ross , Ross B. Berntson
Metal thermal interface materials (TIMs) offer substantially higher thermal conductivity than other commercially available TIMs. With this high conductivity, these metal TIMs offer the lowest thermal interface
resistance, enabling design of higher power and smaller electronic devices. Additionally, the high conductivity translates to less sensitivity to bond line thicknesses and coplanarity issues than polymeric TIMs. This paper discusses the use of metal thermal interface materials
in critical heat flow situations.
TIM
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Posted on 4 Mar 2010
by Bob Jarrett , Jordan Ross
As today’s technology devices continue to get smaller and more powerful, the need for high performance thermal interface materials is becoming more critical. Metal thermal interface materials are the ideal solution to fill this need. The high thermal conductivity of metals and alloys determines how they can be used in thermal solutions. Metals dominate heat sink, spreader, and heat pipe applications due to their high conductivity, as well as their ease and flexibility in fabrication. In critical heat flow situations, metals are frequently used as the thermal interface material (TIM) in the thermal solution.
TIM
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Posted on 8 Mar 2010
by Jacques Matteau
Indium Corporation has commercialized a new technology with NanoFoil® that will revolutionize how manufacturers join components using solder materials (see Figure 1). The joining process is based on the use of reactive multilayer foils as local heat sources. The foils are a new class of nano- engineered materials in which self-propagating exothermic reactions can be ignited at room temperature through an ignition process. By inserting a multilayer foil between two solder layers and two components, heat generated by the reaction in the foil melts the solder and, consequently, bonds are completed at room temperature in air, argon, or vacuum in approximately one second. The resulting metallic joints exhibit thermal conductivities two orders of magnitude higher, and thermal resistivity an order of magnitude lower than current commercial Thermal Interface Materials (TIMs).
The use of reactive foils as a local heat source eliminates the need for torches, furnaces or lasers, speeds the soldering processes and dramatically reduces the total heat that is needed. Thus, temperature-sensitive or small components can be joined without thermal damage or excessive heating. In addition, mismatches in thermal contraction on cooling can be avoided because
components see very small increases in temperature. This is particularly beneficial for joining metals to ceramics. The fabrication and characterization of the reactive foils is described and the value proposition for NanoBonding is presented. This paper also shows the applicability of this platform technology to many areas of packaging, including TIMs, microelectronics, optoelectronics and Light Emitting Diodes (LEDs).
Thermal transfer, TIM, NanoFoil, NanoBond, solder bonding
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Posted on 14 Nov 2011
by Jordan Ross , Andy C. Mackie PhD , Dave Saums, Bob Jarrett
The rise in the heat flux and total power dissipated from semiconductor devices has been well documented in semiconductor packaging industry forecasts. [1, 2, 3] This increasing heat flux (power per unit area, or power density) is not limited to microprocessors and server processors. This general trend affects a variety of commercial and military power semiconductor devices as well as integrated circuits (IC).
The primary determinant of a thermal solution for a semiconductor device or module is the overall heat dissipation. However, at a macro level, the localized heat flux is typically a more critical concern for device reliability. Hot spots with extremely high heat fluxes are a significant concern in the thermal management of processors, RF, wide band gap, power LED, and other semiconductor devices.
indium metal, phase change materials, TIM, thermal management
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Posted on 1 Jul 2009
by Amanda Hartnett , Dr. Ronald C. Lasky
The element indium is an ideal thermal interface material (TIM) for heat dissipation in many of today’s very fast, very hot integrated circuits. Its key advantage is its high bulk thermal conductivity, but other attributes include a low tensile strength and indium’s ability to lower melting temperatures when alloyed with other elements.
TIM, indium
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Posted on 10 Mar 2010
