White Papers

Check the box next to each paper you want to download. You may download as many papers as you wish. After selecting papers and completing the contact information form on this page, the paper(s) will be e-mailed to you at the e-mail address you provide.

Papers about cleaner

• Lead-Free Flux Technology and Influence on Cleaning

  by Dr. Ning-Cheng Lee

  Lead-free flux technology for electronic industry is mainly driven by high soldering temperature, high alloy surface tension, miniaturization, air soldering due to low cost consideration, and environmental concern. Accordingly, the flux features desired included high thermal stability, high resistance against burn-off, high oxidation resistance, high oxygen barrier capability, low surface tension, high fluxing capacity, slow wetting, low moisture pickup, high hot viscosity, and halogen-free. For each of the feature listed above, corresponding desired chemical structures can be deduced, and the impact of those structure on flux residue cleanability can be speculated. Overall, lead-free flux technology results in a greater difficulty in cleaning. Cleaner with a better matching solvency for the residue as well as a higher cleaning temperature or agitation are needed. Alkaline and polar cleaner are often needed to deal with the larger quantity of fluxing products. Reactive cleaner is also desired to address the side reaction products such as crosslinked residue.

  lead-free, flux, flux residue, solder, soldering, cleaner, Cleaning, SMT

  [Permanent Link to this Paper]

  Posted on 1 Jan 2009

The paper(s) you request will be e-mailed in .pdf format to the e-mail address you provide. Please allow up to an hour for the server to process your request.

All fields are required.