White Papers

Check the box next to each paper you want to download. You may download as many papers as you wish. After selecting papers and completing the contact information form on this page, the paper(s) will be e-mailed to you at the e-mail address you provide.

Papers about dip transfer

• Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly

  by Dr. Yan Liu, Pamela Fiacco, Derrick Herron, Dr. Ning-Cheng Lee

  Consideration and selection of dip transfer fluxes and solder pastes for PoP assembly are described, based on process considerations. The crucial properties vital for successful dip transfer include homogeneity, open time on the flux/paste bed, volume and consistency of the dip transferred material, open time after the dip transfer before reflow, and solder joint formation. For each property, one or more practical, recommended test methods are described. Overall, this work should provide the assembly house with an easy way to select a flux or solder paste adequate for dip transfer of PoP assembly applications.

  PoP, package-on-package, flux, solder paste, dip transfer, soldering, SMT

  [Permanent Link to this Paper]

  Posted on 24 Jan 2011

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