Papers about electronics assembly
by Dr. Ronald C. Lasky
It is likely that a modern mobile phone has more computing power than all of the computers that NASA used to send men to the moon in the late 1960s. This idea is especially interesting when one considers that the electronics of that era had almost no integrated circuits (ICs) and that many computer circuits were individual transistors, resistors, and capacitors. Today's PC microprocessors have the equivalent of hundreds of millions of these components, all electrically connected in the IC. Such miniaturization has enabled the electronics revolution.
PCB assembly, electronics assembly, solder joint, solder paste
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Posted on 4 Mar 2010
by Maria Durham , Chris Nash
The electronics industry trend toward miniaturization of electronic assemblies has created the necessity for smaller pitch and bumps on chip-scale-packages (CSP) and package-on-package (PoP) components. Smaller pitch and bumped packages have led to the need for novel solder paste material characteristics. The flux vehicle rheology, powder size, and metal load all play a crucial role in the solder material’s dipping and reflow performance. It is equally important to understand the role of the actual dipping and reflow processes with regard to performance of the material.
electronics assembly, solder paste, chip-scale packages, package-on-package, dipping and reflow process, flux
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Posted on 22 May 2012
by Timothy Jensen
As small surface-mount components such as 0201 and 01005 packages have entered volume assembly, manufacturers are observing increased instances of poor solder coalescence during reflow. The root cause is the change in oxidation behavior at very low volumes of deposited paste. A solution is required, both to restore a high-quality appearance to solder joints and to maintain customer confidence. Comprehensive analysis of factors including material selection, print process settings, reflow profile, and factory-floor practices highlights a number of measures that engineers may apply to solve this issue cost- effectively without impairing satisfactory reflow of other components on the board.
solder paste, pb-free, lead-free, electronics assembly, graping
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Posted on 10 Mar 2010
