Papers about halide-free
Challenges of Implementing a Halogen-Free PCB Assembly Process (Chinese)
by Timothy Jensen , Dr. Ronald C. Lasky
Chinese version of Challenges of Implementing a
Halogen-Free PCB Assembly Process.
oxidation barrier, activator, pb-free, reflow, graping, head-in-pillow, halide-free, halogen-free, halogens, CHINESE LANGUAGE
[Permanent Link to this Paper ]
Posted on 22 Mar 2010
Challenges of Implementing a Halogen-Free PCB Assembly Process (English)
by Dr. Ronald C. Lasky , Timothy Jensen
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries, partly due to public outcry from well publicized 3rd world recycling practices, and partly due to non-government organizations (NGOs) testing and publishing information on electronic devices regarding their content of various toxic materials. One set of materials targeted for reduction and eventual elimination are halogenated compounds. Halogens are found in plastics for cables and housings, board laminate materials, components, and soldering fluxes. Replacing these halogenated compounds can have a dramatic affect on the PCB
assembly process. In this paper those challenges will be discussed as well as techniques and practices that will help ensure high end of line yields and continued reliability.
oxidation barrier, activator, pb-free, reflow, graping, head-in-pillow, halide-free, halogen-free, halogens
[Permanent Link to this Paper ]
Posted on 4 Mar 2010
NC-SMQ®92J Case Study
by ICA
A Contract Equipment Manufacturer conducted an
independent “live”production line test of two solder
pastes and confirmed the age-old adage “You get what
you pay for.”Today’s electronics industry derives its
strength from global marketplace competitive pricing
but beyond price is the overall impact of quality and
production achieved by using technologically superior
products — even if they cost a little more.Solder paste,
an often-undervalued component necessary for elec-
tronics manufacturing,generated significant savings by
achieving higher yields, reducing solder paste scrap,
and eliminating nitrogen processing costs.
halogen-free solder paste, halide-free solder paste, halogen-free, halide-free, head, pillow, head-in-pillow, head in pillow defect, NC-SMQ92J
[Permanent Link to this Paper ]
Posted on 8 Mar 2010
Soldering Challenges in a Halogen-Free PCB Assembly Process (Chinese)
by Amanda Hartnett , Dr. Ronald C. Lasky , Timothy Jensen
Chinese version of Soldering Challenges in a Halogen-Free PCB Assembly Process
halogen-free, halide-free, solder, soldering, graping, flux, head-in-pillow, hole-fill, CHINESE LANGUAGE
[Permanent Link to this Paper ]
Posted on 13 May 2011
Soldering Challenges in a Halogen-Free PCB Assembly Process (English)
by Timothy Jensen , Dr. Ronald C. Lasky , Amanda Hartnett
Flame retardants have played an important role in the safety of many products. It is safe to say that thousands of lives have been saved by flame retardants. Flame retardants are used in products as varied as children's pajamas to electronics assemblies. Some of the more successful flame retardants are halogenated compounds. Halogenated materials are found in polyvinyl chloride (PVC), brominated flame retardants (BFRs), chlorinated flame retardants (CFRs), as well as in fluxes used in the electronics assembly industry. Product does not contain any halogenated compounds. However, that is not exactly how the term is used for soldering fluxes. A flux that is classified as
halide-free by the IPC/J-STD-004 is actually only free of ionic halides.
hole-fill, head-in-pillow, flux, graping, soldering, solder, halide-free, halogen-free
[Permanent Link to this Paper ]
Posted on 10 Mar 2010