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Papers about head

• InTEGRATED® preforms - Reflow Methods

  by Paul Socha

  Solder fabrications, generally referred to as preforms, can be made to fit many different and unique applications. Preforms are designed to have a particular shape and deliver a specified volume of solder to the solder joint. Preforms can be divided into two subclasses: conventional, where the preforms are punched from solder ribbon, and InTEGRATED® preforms, which are chemically etched from solder foil. In this article, we will discuss how InTEGRATED® preforms are used and, in particular, methods that are frequently utilized to reflow them to maximize quality and production.

  halogen-free solder paste, halogen-free, head, pillow, head in pillow defect, integrated preforms

  [Permanent Link to this Paper]

  Posted on 8 Mar 2010

• NC-SMQ®92J Case Study

  by ICA

  A Contract Equipment Manufacturer conducted an independent “live”production line test of two solder pastes and confirmed the age-old adage “You get what you pay for.”Today’s electronics industry derives its strength from global marketplace competitive pricing but beyond price is the overall impact of quality and production achieved by using technologically superior products — even if they cost a little more.Solder paste, an often-undervalued component necessary for elec- tronics manufacturing,generated significant savings by achieving higher yields, reducing solder paste scrap, and eliminating nitrogen processing costs.

  halogen-free solder paste, halide-free solder paste, halogen-free, halide-free, head, pillow, head-in-pillow, head in pillow defect, NC-SMQ92J

  [Permanent Link to this Paper]

  Posted on 8 Mar 2010

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