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Indium Corporation conducts extensive research on the soldering fundamentals for Surface Mount Technology and other electronics applications.

Browse our library for abstracts of some of the most popular published articles that you may find useful in your efforts to improve your process results. All papers in our library are available for download.

Check the box next to each paper you want to download. You may download as many papers as you wish. After selecting papers and completing the contact information form on this page, the paper(s) will be e-mailed to you at the e-mail address you provide.

    Papers about hole-fill

  • Soldering Challenges in a Halogen-Free PCB Assembly Process (Chinese)

    by Amanda Hartnett, Dr. Ronald C. Lasky, Timothy Jensen

    Chinese version of Soldering Challenges in a Halogen-Free PCB Assembly Process

    halogen-free, halide-free, solder, soldering, graping, flux, head-in-pillow, hole-fill, CHINESE LANGUAGE

    Posted on 13 May 2011

  • Soldering Challenges in a Halogen-Free PCB Assembly Process (English)

    by Timothy Jensen, Dr. Ronald C. Lasky, Amanda Hartnett

    Flame retardants have played an important role in the safety of many products. It is safe to say that thousands of lives have been saved by flame retardants. Flame retardants are used in products as varied as children's pajamas to electronics assemblies. Some of the more successful flame retardants are halogenated compounds. Halogenated materials are found in polyvinyl chloride (PVC), brominated flame retardants (BFRs), chlorinated flame retardants (CFRs), as well as in fluxes used in the electronics assembly industry. Product does not contain any halogenated compounds. However, that is not exactly how the term is used for soldering fluxes. A flux that is classified as halide-free by the IPC/J-STD-004 is actually only free of ionic halides.

    hole-fill, head-in-pillow, flux, graping, soldering, solder, halide-free, halogen-free

    Posted on 10 Mar 2010

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