Papers about indium
by Claire Mikolajczak , Bill Jackson
Chinese version of Availability of Indium and Gallium
CHINESE LANGUAGE, gallium extraction process, gallium mining, reclaiming ITO targets, indium refining capacities, tailings, slag, indium residues, indium, gallium, availability of indium and gallium, indium ores and mining, indium extraction
[Permanent Link to this Paper ]
Posted on 22 May 2012
by Bill Jackson , Claire Mikolajczak
“Long term, both
indium and gallium will be available with intermittent price volatility.” — Claire Mikolajczak
indium extraction, indium ores and mining, availability of indium and gallium, gallium, indium, indium residues, slag, tailings, indium refining capacities, reclaiming ITO targets, gallium mining, gallium extraction process
[Permanent Link to this Paper ]
Posted on 23 Apr 2012
by Claire Mikolajczak
German language version of Availability of
Indium and Gallium.
Copper Indium Gallium, CIG, German language, indium, solar, thin film technology
[Permanent Link to this Paper ]
Posted on 11 Mar 2010
by Dr. Ning-Cheng Lee
Lead-free soldering , originally started as an environmental issue, is evolving rapidly into a business survival tool for the worldwide electronic industry. Promising lead-free solder alternatives for surface mount assembly applications include eutectic Sn/Ag, eutectic Sn/Cu, Sn95/Sb5, eutectic Sn/Bi, Sn/Ag/Cu, Sn/Ag/Cu/X, Sn/Bi/Ag/X, Sn/Zn/X, and Sn/In/Ag/(X). However, for wafer level area array solder bump interconnects, most of those options fall short in terms of fatigue resistance. Sn/In/Ag/(X) appears to be superior when compared with Sn63/Pb37, as demonstrated by Sn/In/Ag/Cu. For applications involving high lead solders, no solder alternatives have been developed yet. While the industry is advancing toward being finer, smaller, lighter, and faster, wafer level packages using area array solder interconnects is suffering from the soft error due to alpha emission from the lead in the solders. Although lead-free solder alternatives for eutectic Sn/Pb are virtually free from alpha emission, the continuous dependence on the use of high-lead solders for C4 applications indicates that the challenge of alpha emission from lead-containing solders will persist regardless of the lead-free move of the industry. This challenge is getting tougher with the rapid advancement of IC design toward further miniaturization. Low alpha lead can be obtained from cold lead ore, old lead, and laser isotope separation process, with the latter having potential as a long term solution. The price of those low alpha lead is very expensive when compared with the regular lead. Due to the increase in I/O density, requirement on alpha emission level may soon move from LC2 to LC3 level. The supply of low alpha lead for wafer level interconnects does not seem to be an issue.
lead-free, solder, soldering, wafer level interconnect, Flip Chip, CSP, BGA, alpha emission, low alpha solders, soft error, indium, pb-free
[Permanent Link to this Paper ]
Posted on 1 Jan 2009
by Michael D Murphy, Claire Mikolajczak
The elements indium and gallium are key components in the manufacture
of products in high volume emerging markets. The strategic nature of these
elements, coupled with some published reports concerning shortages, has
raised some legitimate questions about the sustainability of their supply chains.
Indium Corporation has studied these markets as well as the mining and refining
operations in detail. In this paper, we intend to answer these questions.
CIG, ITO, FPD, metal supply, gallium, indium, SVC Tech Con 2011
[Permanent Link to this Paper ]
Posted on 19 Apr 2011
by Claire Mikolajczak , Greg Phipps, Terry Guckes
indium, gallium, metal supply
[Permanent Link to this Paper ]
Posted on 10 Mar 2010
by Amanda Hartnett , Dr. Ronald C. Lasky
The element indium is an ideal thermal interface material (TIM) for heat dissipation in many of today’s very fast, very hot integrated circuits. Its key advantage is its high bulk thermal conductivity, but other attributes include a low tensile strength and indium’s ability to lower melting temperatures when alloyed with other elements.
TIM, indium
[Permanent Link to this Paper ]
Posted on 10 Mar 2010
