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Papers about indium metal

• Thermal Management Materials Choices

  by Jordan Ross, Andy C. Mackie PhD, Dave Saums, Bob Jarrett

  The rise in the heat flux and total power dissipated from semiconductor devices has been well documented in semiconductor packaging industry forecasts. [1, 2, 3] This increasing heat flux (power per unit area, or power density) is not limited to microprocessors and server processors. This general trend affects a variety of commercial and military power semiconductor devices as well as integrated circuits (IC). The primary determinant of a thermal solution for a semiconductor device or module is the overall heat dissipation. However, at a macro level, the localized heat flux is typically a more critical concern for device reliability. Hot spots with extremely high heat fluxes are a significant concern in the thermal management of processors, RF, wide band gap, power LED, and other semiconductor devices.

  indium metal, phase change materials, TIM, thermal management

  [Permanent Link to this Paper]

  Posted on 1 Jul 2009

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