White Papers

Check the box next to each paper you want to download. You may download as many papers as you wish. After selecting papers and completing the contact information form on this page, the paper(s) will be e-mailed to you at the e-mail address you provide.

Papers about low temperature soldering

• Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework

  by Brook Sandy, Ed Briggs, Dr. Ronald C. Lasky

  The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more.

  bismuth, bismuth based alloys, low temperature soldering, pb-free, delamination, lead-free

  [Permanent Link to this Paper]

  Posted on 6 Jun 2011

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