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Indium Corporation conducts extensive research on the soldering fundamentals for Surface Mount Technology and other electronics applications.

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  • Solder Paste Evaluation Techniques to Simplify the Transition to Pb-Free

    by Timothy Jensen

    As the July 1, 2006 Pb-free deadline approaches, many electronics assemblers are beginning to fathom the changes and process demands required. The two biggest material concerns involve solder paste and components. This document provides practical recommendations for evaluating Pb-free solder pastes and ensuring that the selected solder paste will deliver assembly yields comparable to, or better than, the incumbent Sn/Pb solder paste.

    lead-free, pb-free, stencil printing, reflow, response to pause, evaluation, solder paste

    [Permanent Link to this Paper]

    Posted on 1 Jan 2009

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