White Papers

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Papers about room temperature bonding

• Room Temperature LED and D-Pak Type Component-Attach and Reliability Testing

  by Mario Scalzo, Thomas Acchione

  Engineers working with LED and D-pak type component-attach are looking for improved assembly materials and process enhancements to increase throughput, reduce cost, and improve product efficiency and reliability. Many of these packages are susceptible to higher voiding on the ground plate-attach during reflow. A room temperature process would lower voiding, reduce the failure rate, and increase the lifetime of the component. Technology developments have proven that it is possible to use a localized heat source to bond components at room temperature. This paper discusses the bonding of LED and D-pak components at room temperature. It also talks about the quality and long term reliability of the components. The presentation will demonstrate the component bonding process both manually and through the use of automation, and show attendees how to verify the performance of the components post bonding.

  NanoFoil, NanoBond, LED, CTE mismatch, room temperature bonding

  [Permanent Link to this Paper]

  Posted on 24 Jan 2011

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