White Papers

Indium Corporation conducts extensive research on the soldering fundamentals for Surface Mount Technology and other electronics applications.

Browse our library for abstracts of some of the most popular published articles that you may find useful in your efforts to improve your process results. All papers in our library are available for download.

Check the box next to each paper you want to download. You may download as many papers as you wish. After selecting papers and completing the contact information form on this page, the paper(s) will be e-mailed to you at the e-mail address you provide.

    Papers about solder-fillet-lifting

  • Reflow Soldering: Meeting the SMT Challenge

    by Dr. Ning-Cheng Lee

    Reflow soldering of solder paste is the primary interconnection method used in SMT assembly process. The major issues which plague the reflow soldering performance include, but not limited to, bottom-side-component-holding, bridging, dewetting, low-residue, opening, solder balling, solder beading, solder-fillet-lifting, tombstoning, defective balling for BGA, and voiding. The mechanisms, causes, and cures for each issue are briefly discussed in this article.

    lead-free, soldering, solder paste, SMT, bridging, dewetting, opening, solder balling, solder beading, solder-fillet-lifting, tombstoning, balling for BGA, voiding, pb-free, reflow

    [Permanent Link to this Paper]

    Posted on 1 Jan 2009

The paper(s) you request will be e-mailed in .pdf format to the e-mail address you provide. Please allow up to an hour for the server to process your request.

All fields are required.

Share This
Share on Facebook Share on LinkedIn
Tweet this Digg this Add to del.icio.us More