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Papers about solder quality

• Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly

  by Chris Anglin

  The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3mm CSPs are some of the components that must be assembled to enable these portable electronic devices. It is widely accepted that about 65% of all end of the line defects occur in the stencil printing process. Given all of the above it is critical that a precision stencil printing process be developed to support miniaturized electronic assembly.

  This paper will be a summary of a significant amount of experimental data and process optimization techniques that were employed to establish precision SMT printing process. Our results indicate that the industry standard stencil aperture aspect ratio requirement of > 0.66 is an excellent rule of thumb. However, by optimizing printer setup with vacuum support, foil-less clamps, squeegee edge guards etc and assuring cleanliness and squeegee and stencil quality, we have been able to obtain acceptable stencil printing results with area ratios of 0.5 with Type III solder pastes. The work that was performed to achieve these results will be discussed in detail in the paper.

  halogen-free, solder paste, solder, solder reliability, flux, solder quality, stencil printing

  [Permanent Link to this Paper]

  Posted on 11 May 2009

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