White Papers

Indium Corporation conducts extensive research on the soldering fundamentals for Surface Mount Technology and other electronics applications.

Browse our library for abstracts of some of the most popular published articles that you may find useful in your efforts to improve your process results. All papers in our library are available for download.

Check the box next to each paper you want to download. You may download as many papers as you wish. After selecting papers and completing the contact information form on this page, the paper(s) will be e-mailed to you at the e-mail address you provide.

    Papers about stencil apertures

  • Stencil Printing Transfer Efficiency of Circular vs. Square Apertures with the Same Solder Paste Volume

    by Chris Anglin, Ed Briggs

    This paper is a summary of best practices in optimizing the printing process focusing on comparison of large and small apertures, square vs. round, not with the same area ratio but with similar or the same volume. This paper will definitively clear the air on the round versus square aperture debate.

    SMT, circuit board assembly, stencil apertures, solder paste, stencil printing

    [Permanent Link to this Paper]

    Posted on 21 Jun 2011

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