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David Day, Richard Brooks, Vahid Goudarzi
Summary: This paper will outline the issues relating to the implementation of a Pb-free solder paste into a
standard Sn/Pb manufacturing facility and product. The Pb-free study includes the compatibility and impact on the various manufacturing processes that include, printing, component placement, reflow process, and solder joint quality.
These parameters must be fully characterized to ensure that the lead-free solder paste meets the manufacturing and product quality requirements. In addition, a lower super heat temperature is critical to reduce the thermal stress on components, since the lead-free alloy composition (Sn/Ag/Cu) liquefies at about 34 C higher than the current leaded material (63Sn/37Pb). Several implementation issues were discovered during the pilot phases and resolved prior to full-scale production manufacturing. Some of the problems revealed were BGA voiding, chip component tombstoning, and component integrity as it relates to termination plating and moisture sensitivity.
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