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Jim Hisert, Thomas Acchione
Solar PV cell and module manufacturers are looking for new and improved assembly materials and process enhancements to increase throughput, reduce cost, and improve cell efficiency. To reach these (dynamic) higher goals for thin film deposition, new materials and cost-effective processes are needed. Depositing the target material directly onto the backing plate is typically used when conventional target bonding is simply not possible because of the low-melting point range of materials. When using the low melting alloys or single elements in thin film cells (CIG, CuGa, In, and InSn), it is possible to use a localized heat source to bond them at room temperature. This paper discusses:
1) the casting of these low-melting alloy sputtering targets, and 2) the subsequent bonding of the alloys to a backing plate for use in existing equipment.
In addition, the presentation will demonstrate the bonding of low-melting point metallic sputtering targets, as well as how to verify the performance of these targets during operation.
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