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Chris Nash, Maria Durham
Summary: The electronics industry trend toward miniaturization of electronic assemblies
has created the necessity for smaller pitch and bumps on chip-scale-packages
(CSP) and package-on-package (PoP) components. Smaller pitch and bumped
packages have led to the need for novel solder paste material characteristics.
The flux vehicle rheology, powder size, and metal load all play a crucial role in
the solder material’s dipping and reflow performance. It is equally important to
understand the role of the actual dipping and reflow processes with regard to
performance of the material.
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