- Maintains standoff
- Bridges gaps
- Adds strength to solder joints
Clad Solder Preforms are manufactured shapes that deliver a precise amount of solder while maintaining and/or bridging a particular gap. They consist of a copper layer that is clad on one or both sides with a specified thickness of solder. Dimensions can be held to tight tolerances to assure volume accuracy. Clad solder preforms come in standard shapes and sizes such as squares, rectangles, washers, frames and discs. Typical sizes range from .254mm up to 50.8mm. A variety of sizes and shapes are available.
Typical alloys include:
- Other alloys are available upon request.
The core material is OFHC Copper:
- Annealed Per ASTM-B152
- F scale
- Tensile Strength 35,000 psi max.
- Other coppers are available upon request.
Clad Solder Preforms are packaged in formats similar to standard preforms and take into consideration the size and strength of the preform. Common packing methods include jars, boxes (stack or layer pack) and tape & reel. Most packages can be backfilled with argon upon request.
When possible, we suggest filling each package with the quantity of clad solder preforms that will be consumed in one shift.
Storage and Handling Procedures
Clad Solder Preforms should be kept in their unopened container in a cool dry place until time of use, preferably in a nitrogen dry box. After opening, any unused preforms should be stored in these same conditions.
Eating, drinking and smoking should be avoided while handling preforms. Hands should be washed immediately following use. If possible, preforms should be handled with protective gloves or finger cots.
- Heat Sink Attach
- Pin Soldering
- 3D Soldering
- Jumper Bridges
And other soldering applications where the following properties are desired:
- Wear Resistance
- Electrical Properties
- Thermal Properties
- Clad Solder Preforms can be flux coated with any of our standard preform flux coatings.
- Indium Corporation’s liquid fluxes and TACfluxes.
Related Markets and Applications
Clad Preforms Technical Documents
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Product Data Sheets
Safety Data Sheets
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Clad Preforms Blog Posts
Using Solder Fortification® to improve solder joint reliability in through-hole component applications
Not all fluxes can handle the high processing temperature required for Au/Sn solder preforms.
Using Solder Fortification preforms to increase solder volume can significantly reduce voiding in QFN components
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.