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Burn-in and Test

Home » Applications » Thermal Management » Burn-in and Test

  • Burn-in and Test
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Burn-in Burn-in Bonding Burn-in Attributes

Introduction

Indium Corporation offers:

  • Heat-Spring® - Metal Thermal Interface designed to fit your burn-in head to optimize performance.
  • Adhesive TIM Tabs (made with Kapton®) – holds the Heat-Spring® in place on the burn-in head.
    (Kapton® is a registered trademark of DuPont)
  • Solders - for evaporations and heaters in the stack up.

Heat-Spring®

  • Repeated use saves time and money - can be inserted well over 1000 times, depending on the application design and process settings.
  • Easy to use - just pick and place with tweezers or vacuum nozzle
  • Clean - no messy residue
  • Environmentally friendly - recyclable and reclaimable

Common alloys:

  • Indalloy® #4 - 99.99% Indium
  • Indalloy® #1E - 52In/48Sn
  • Indalloy® #3 - 90In/10Ag
  • Indalloy® #290 - 97In/3Ag

Note: When using gold or copper, custom cladding is available to act as a diffusion barrier

Common form factors:

  • Squares 0.5", 1.0", 1.5", and 2.0"
  • Rectangles
  • Custom cross shapes
  • Custom thicknesses for bare die and lidded applications

Attributes:

  • Compliant
  • High conductivity
  • 86 W/mK
  • Durable, many cycles
Material Thermal Conductivity
(W/mK)
Flow Stress
(psi)
Indium 86 280
Copper 385 4800
Lead 35 1800
LMA 20 -
Grease 2 -

Resistance:
Baseline of Burn-in TIMs

Thermal Resistance
of Metal TIMs

Resistance Graph Thermal Resistance Graph
View Full Size Chart View Full Size Chart

Cycling Tests:

12 mil 90In/10Ag
Cycling Tests

 
Cycling Tests
View Full Size Chart

Adhesive TIM Tab (made with Kapton®)

  • Ensures that the metal thermal interface material is intimate with the burn-in head
  • Can withstand temperatures up to 260°C (500°F)
  • No residue
  • Low-static
  • Available in 3/4" or 1" discs (specialty sizes and shapes available upon request)

Solders

Solders for evaporators and heaters in the stack up

  • Engineered melting temps for step soldering
  • High conductivity alloys to help efficiency of design

Common Alloys:

Indalloy® # Eutectic Melting Temperature Alloy Composition
19 60 E 51.0In/32.5Bi/16.5Sn
1E 118 E 52.0In/48.0Sn
281 138 E 58.0Bi/42.0Sn
290 143 E 97.0In/3.0Ag
201 199 E 91.0Sn/9.0Zn
238 217 E 90.0Sn/10.0Au
121 221 E 96.5Sn/3.5Ag
182 280 E 80.0Au/20.0Sn
183 356 E 88.0Au/12.0Ge
184 363 E 96.8Au/3.2Si
176 382 E 95.0Zn/5.0Al
186 424 E 55.0Ge/45.0Al

The Indium Corporation Advantage

We are committed to understanding your unique needs for materials in your product and for your process. No company offers a wider selection of alloys and solder forms to meet your needs. Our variety of alloys, ability to fabricate and package these alloys into easy-to-use forms, and our decades of application knowledge are the core values we bring to your company. Tap into this knowledge-base by calling one of our certified engineers at 1-800-4-INDIUM or visit www.indium.com.

Burn-in and Test Product Links

  • Thermal Management

Top Burn-in Technical Documents

  • 5RA and 5RMA Liquid Fluxes for TIMs (Letter) (A4)

    Product Data Sheet

  • Alloy Sorted By Indalloy® Number (Other)

    Other Document

  • Alloy Sorted by Temperature (Other)

    Other Document

  • Indium Thermal Interface Materials (TIM) (Letter)

    Product Data Sheet

Burn-In and Test Technical Documents

Whitepapers

Request This Document

Thermal Management Materials Choices

Authors: Andy C. Mackie PhD, Bob Jarrett, Dave Saums, Jordan Ross

Posted on 1 Jul 2009

Application Notes

No application notes to display

Product Data Sheets

5RA and 5RMA Liquid Fluxes for TIMs (Letter) (A4)
Indium Thermal Interface Materials (TIM) (Letter) (A4)
Soft Metal Alloy Thermal Interface Materials (Letter) (A4)

View All

Material Safety Data Sheets

No material safety data sheets to display

Other Documents

Alloy Sorted By Indalloy® Number (Other)
Alloy Sorted by Temperature (Other)
Pb-Cd Free (Other)
Thermal Resistance (ASTM D5470) (Other)

View All

Burn-in Blog Posts

NanoFoil® Scrap Handling Suggestions

Tuesday, March 19, 2013 by Jim Hisert [view bio]

Let’s start with a bit of fiction to get us on the same page… Mike is working with NanoFoil®, getting ready to bond a small, round, planar sputtering target. He has prepared his backing plate and target material and is ready to assemble the stack after cutting a piece of NanoFoil®…

Electronics Failure Analysis for Pb- and Pb-Free Solder Joints

Monday, October 08, 2012 by Dr. Ron Lasky [view bio]

Folks,   The Weibull distribution is arguably the most important distribution in failure analysis of leaded and lead-free solder joints.  It is the first thought of someone trying to model thermal cycle, drop shock, or other failure modes associated with through-hole and SMT assembly. The…

High Melting Point Flux Core Wire Solder

Tuesday, July 17, 2012 by Carol Gowans [view bio]

It won't be long until we in the northern hemisphere are complaining about the snow and the cold, but right now, it is all about the heat!  In particular about the heat that is needed to reflow high melting point (HMP) alloys.  These are generally high-Pb alloys that see very high operational…

View All Blog Posts

#
Jordan Ross

This page is owned by:

Jordan Ross
Senior Product Manager, Engineered Solders and Thermal Materials
jross@indium.com

INDIUM CORPORATIONwww.indium.comaskus@indium.comPRC +86 (0)512 628 34900SINGAPORE +65 6 268 8678UK +44 (0) 1908 580400USA +1 315 853 4900

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