Burn-in and Test
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Burn-in and Test Blog Posts
Solder Redefined
Considering the relentless push for higher power densities, coupled with increased cycling, a lot is being asked of insulated-gate bipolar transistors (IGBTs)...
Avoid the Void™ Using Heat-Spring Metal Thermal Interface Materials
Indium Corporation's Product Manager for Engineered Solders Materials Tim Jensen discusses the issue of voiding in thermal management and how you can Avoid the Void™...
Thermal Management: Why Indium is the Best Choice
In our first review of our Heat-Spring® metal thermal interface material product line, we noted that the Heat-Spring® sprang from customer need...
Thermal Management Using Indium Metal: The Heat-Spring®
Indium metal has long been used for a variety of applications including low-temperature solder, cryogenic sealing, coatings for touch screens, and in fusible alloys...
Applying Solder Preforms – Compression
Most people think of our alloys only in the ‘soldering’ sense. However, these same materials may be used in applications where they aren’t designed to melt and attach components...
Design Solutions for Engineered Solders
Today’s technology simplifies the translation of an idea into a design. A drawing can be dimensioned in an instant. Thermal models and strength of materials calculations predict the reliability of a solder joint before a single part is made...
For comments or questions about the content on this page, please contact:
Tim Jensen
Product Manager for Engineered Solder Materials
tjensen@indium.com
From One Engineer to Another®
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