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Burn-in and Test

Home » Applications » Thermal Management » Burn-in and Test

  • Burn-in
    and Test
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Your browser does not support the video tag. Burn-in And Test Burn-in And Test
Burn-in And Test
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Optimize Your Burn-In Process with Metal Thermal Interface Materials

Early detection of possible failures is critical to avoid costly replacements at the assembly level. Indium Corporation offers several metal thermal interface products to optimize the burn-in process and improve process yields.

Metal burn-in materials have several advantages:

  • High thermal conductivity
  • Easy handling and cleaning
  • No pump out or bake out
  • Ability to handle multiple insertions
  • Available in standard or custom configurations

Indium Corporation’s metal thermal interface materials include:

Heat-Spring®

  • Patterned to optimize contact with non-planar surfaces 86W/mK
  • Compliant
  • Available alloys include InAg, InSn, and pure indium
  • Recyclable
  • Aluminum cladding available as a diffusion barrier for pure indium

HSMF-OS

  • Tacky for easy placement
  • Compliant and compressible
  • Durable

Indium Foils

  • Unpatterned
  • For use with planar surfaces
  • Available alloys include InAg, InSn, and pure indium
  • Recyclable

Burn-in and Test Product Links

  • Thermal Management

Top Burn-in and Test Technical Documents

  • Comparison of Test Methods for High Performance Thermal Interface Materials (Paper)

    Technical Paper

  • Full Metal TIMs (English) (Paper)

    Technical Paper

  • Development with Metallic TIMs (Paper)

    Technical Paper

Burn-in and Test Technical Documents

Whitepapers

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Comparison of Test Methods for High Performance Thermal Interface Materials

Authors: Bob Jarrett, C.K. Merritt, Jim Hisert, Jordan Ross

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Development with Metallic TIMs

Authors: Timothy Jensen

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Full Metal TIMs (English)

Authors: Bob Jarrett, Jordan Ross, Ross B. Berntson

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Sn+ Heat- Spring® Solder TIMs for Superior Thermal Management in IGBT Power Modules

Authors: Bob Jarrett, Graham Wilson

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Thermal Management Materials Choices

Authors: Andy C. Mackie PhD, Bob Jarrett, Jordan Ross

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Virtues of Indium as a Thermal Interface Material

Authors: Dr. Ronald C. Lasky

Presentations

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Application Notes

Indium Thermal Interface Materials (TIM) (US Letter)
Indium Thermal Interface Materials (TIM) (A4)
Use of Heat-Spring® Material (US Letter)
What is a Thermal Interface? (A4)
What is a Thermal Interface? (US Letter)

Product Data Sheets

5RMA and 5RA Liquid Fluxes for Solder Thermal Interface Applications (sTIM) (US Letter)
5RMA and 5RA Liquid Fluxes for Solder Thermal Interface Applications (sTIM) (A4)

Safety Data Sheets

5RA-RC Flux
LIQUID FLUX 5RA-RC
OnSpec® Solar Grade Flux 5RA (Liquid)
HSMF
Liquid Flux 5RMA
OnSpec® Solar Grade Flux 5RA (Resin)

Burn-in and Test Blog Posts

Solder Redefined

15 Nov 2016 by Seth Homer [view bio]

Considering the relentless push for higher power densities, coupled with increased cycling, a lot is being asked of insulated-gate bipolar transistors (IGBTs)...

Read More

Avoid the Void™ Using Heat-Spring Metal Thermal Interface Materials

18 Mar 2016 by Tim Jensen [view bio]

Indium Corporation's Product Manager for Engineered Solders Materials Tim Jensen discusses the issue of voiding in thermal management and how you can Avoid the Void™...

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Thermal Management: Why Indium is the Best Choice

29 Feb 2016 by Carol Gowans [view bio]

In our first review of our Heat-Spring® metal thermal interface material product line, we noted that the Heat-Spring® sprang from customer need...

Read More

Thermal Management Using Indium Metal: The Heat-Spring®

2 Feb 2016 by Carol Gowans [view bio]

Indium metal has long been used for a variety of applications including low-temperature solder, cryogenic sealing, coatings for touch screens, and in fusible alloys...

Read More

Applying Solder Preforms – Compression

27 Apr 2015 by Jim Hisert [view bio]

Most people think of our alloys only in the ‘soldering’ sense. However, these same materials may be used in applications where they aren’t designed to melt and attach components...

Read More

Design Solutions for Engineered Solders

31 Mar 2015 by Seth Homer [view bio]

Today’s technology simplifies the translation of an idea into a design. A drawing can be dimensioned in an instant. Thermal models and strength of materials calculations predict the reliability of a solder joint before a single part is made...

Read More

View All Blog Posts

For comments or questions about the content on this page, please contact:

Tim Jensen
Product Manager for Engineered Solder Materials
tjensen@indium.com

From One Engineer to Another®

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