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Burn-in Blog Posts
NanoFoil® Scrap Handling Suggestions
Let’s start with a bit of fiction to get us on the same page… Mike is working with NanoFoil®, getting ready to bond a small, round, planar sputtering target. He has prepared his backing plate and target material and is ready to assemble the stack after cutting a piece of NanoFoil®…
Electronics Failure Analysis for Pb- and Pb-Free Solder Joints
Folks, The Weibull distribution is arguably the most important distribution in failure analysis of leaded and lead-free solder joints. It is the first thought of someone trying to model thermal cycle, drop shock, or other failure modes associated with through-hole and SMT assembly. The…
High Melting Point Flux Core Wire Solder
It won't be long until we in the northern hemisphere are complaining about the snow and the cold, but right now, it is all about the heat! In particular about the heat that is needed to reflow high melting point (HMP) alloys. These are generally high-Pb alloys that see very high operational…

This page is owned by:
Jordan Ross
Senior Product Manager, Engineered Solders and Thermal Materials
jross@indium.com
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