Indium Corporation manufactures die-attach solder paste, such as Indium8.9-LDA, for vacuum soldering. Indium Corporation's IGBT die-attach solder paste can be screen printed or stencil printed and is easy to clean.
Indium Corporation also provides solder ribbon and solder preforms for die-attach applications. Tape & reel packaging allows preforms to be advanced and placed with speed and accuracy. Semiconductor-grade ribbon and preforms come in ultra-pure alloys and adaptable packaging, such as tape & reel, custom spools, and cartridge packs, to increase productivity, performance, and efficiencies.
All material is recyclable and reclaimable.
Materials for Vacuum Soldering
Direct Bonded Copper (DBC) or Substrate-Attach
Indium Corporation's soldering materials for DBC-attach include solder ribbon and solder preforms. Manufactured for purity, they offer low voiding when reflowed in air or vacuum.
InFORMS® were developed to solve the non-planar solder joint issue common in substrate bonding. InFORMS® are reinforced solder alloy fabrications that ensure parallel soldering at a predetermined bondline thickness.
NanoFoil® solders a component in nanoseconds without using a reflow oven. NanoFoil® provides a localized heat source that enables high strength, high conductivity bonding between most combinations of materials. NanoFoil® emits enough energy to solder 25-150+ micron bondlines. In addition, tin-plated NanoFoil has been used to solder gold-plated substrates together without the need for a reflow oven or any plating. For more information, visit www.indium.com/nanofoil/.
Materials for Substrate-Attach
Heat-Sink or Baseplate-Attach
Removing heat from a power module is important for ensuring interconnect reliability. Indium Corporation's Heat-Spring® material is a non-reflow compressible metal pad with a thermal conductivity of 86W/mK. Unlike some of the more typical thermal interface materials, such as thermal grease, Heat-Springs® do not pump out or bake out.
Heat-Springs® can be engineered and optimized for difficult applications and a wide variety of surface conditions. Minimum pressure required is 25-45psi and minimum thickness is 75 microns. Custom packaging includes tape & reel and tray packs. See our application note entitled "Heat-Spring® Metallic Thermal Interface Materials for Application to Infineon Technologies AG PrimePACK IGBT Modules" for information on how Indium Corporation's Heat-Springs® performed in testing against a comparable flat indium shim and two typical silicone-based thermal grease materials.
Liquid metal is another material that can be used as a thermal interface. Liquid metal is RoHS-compliant and has a thermal conductivity of 40W/mK and a contact resistance of virtually zero.
Materials for Heat-Sink or Baseplate-Attach
Solder Redefined - Video 1: Introduction
Solder Redefined - Video 2: Die-Attach
Solder Redefined - Video 3: DBC Substrate to Baseplate
Solder Redefined - Video 4: Baseplate to Heat-Sink
Avoid the Void®: Voiding in High-Temperature Soldering
Avoid the Void®: High-Temperature Soldering with Semiconductor-Grade Preforms
Related Markets and Applications
Top IGBT Technical Documents
New Developments in High Performance Solder Products for Power Die Assemblies (Paper)
IGBT and Engine Control Technical Documents
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Product Data Sheets
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Safety Data Sheets
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Thermal Management Blog Posts
Find out why indium metal is the optimum choice for high-end electronics thermal management, even though some metals have higher thermal conductivity values.
High performance thermal management requires high performance materials. In this case, Heat-Spring®
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some exciting work using InFORM® technology to make more reliable solder joints at a lower...
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.