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Generation 10

Home » Products » NanoFoil® » Sputtering Target Bonding » Generation 10

  • Generation 10
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Indium Corporation's sputtering target application team has used its patented NanoFoil® and NanoBond® technology to bond a Generation 10 size sputtering target. The video and processing steps are below, please contact Jacques Matteau directly with any questions you may have!

Indium Corporation
34 Robinson Rd,
Clinton, NY 13323
Phone: 315-853-4900
E-mail: jmatteau@indium.com

Watch the Video of the Process

RNT Demonstrates Flat Panel Display Generation 10 Bonding Capability

Generation 10 sputtering targets range in size depending on the distributor and end user, but most are in the range of 12 feet (3657mm) by 1foot (304mm). The image below shows the NanoFoil® assembly prior to activation of the NanoFoil®.

Generation 10 Long Linear Stack Up
Generation 10 Long Linear Stack Up

Related Markets and Applications

  • Target Bonding
  • Solders

Top Generation 10 Technical Documents

  • Eliminating Bond Stress of Sputtering Targets at Operational Temperatures (Paper)

    Technical Paper

  • High Temperature, Pb-Free, Metallic Sputtering Target Bonding Using Reactive Multilayer Foil (Paper)

    Technical Paper

Generation 10 Technical Documents

Whitepapers

Request This Document
Watch Video

Eliminating Bond Stress of Sputtering Targets at Operational Temperatures

Authors: Jim Hisert

Request This Document

High Temperature, Pb-Free, Metallic Sputtering Target Bonding Using Reactive Multilayer Foil

Authors: Jim Hisert, Ronnie Spraker

Request This Document

Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient)

Authors: Jim Hisert

Request This Document

Stress-Free Bonding of Large Linear Sputtering Targets for LCD Displays

Authors:

Presentations

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Application Notes

Bonding Sputtering Targets with NanoFoil® (US Letter)
Large Area Bonding Using NanoFoil® (US Letter)
NanoBond® of Ceramic and Metal Sputtering Targets (A4)
NanoBond® of Ceramic and Metal Sputtering Targets (US Letter)
NanoBond®: The Process for Using NanoFoil® (US Letter)

Product Data Sheets

WMA-SMQ69HT High Temperature Water Soluble Solder Paste (US Letter)

Safety Data Sheets

No safety data sheets to display

Sputtering Target Blog Posts

Indium Recycling: Rotary Vs. Planar Indium, CIG, and ITO Targets

14 Jun 2017 by Jim Hisert [view bio]

The reclaim/recycling aspect of both rotary and planar indium-containing sputtering targets.

Read More

Quality, Service, Reliability in the Copper-Indium-Gallium (CIG) Rotary Sputtering Target Market

13 Feb 2015 by Indium Corporation® [view bio]

Our CIG (copper – indium – gallium) sputtering target customers demand many things from us as a vendor. Of course they do! The difference between merely operating and excelling can produce results for...

Read More

Indium Wire

02 Dec 2013 by Jim Hisert [view bio]

Indium wire is very different than the solder wire you find in hardware stores. To me, it’s like comparing a sports car and a go-kart. Each perform differently, are made for a very different...

Read More

View All Blog Posts

For comments or questions about the content on this page, please contact:

Tim Jensen
Product Manager for Engineered Solder Materials
tjensen@indium.com

From One Engineer to Another®

All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.

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