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Voiding and Reliability in the Assembly of BGAs Using SAC and 57Bi/42Sn/1Ag Alloys
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study, BGAs with SAC105, SAC305, and BiSnAg balls were assembled with SAC105, SAC305 or 57Bi42Sn1Ag solder paste. Joint mechanical strength, drop test performance, and voiding performance were evaluated against the reflow profile. Download this paper here: http://bit.ly/1meBfHA
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