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Indium8.9 delivers more performance features than any other Pb-Free solder paste ever made.

It provides excellend print-transfer properties: Designed for CSP, 0201, and 01005 technology.

Who isn’t looking for consistent print volumes? It is designed to print through aperatures below the industry recommended minimum area ratio of 0.66.

It delivers a robust reflow process window and can accommodate high peak temperatures and long soak profiles

Indium8.9 provide excellent test probeability.

It is thermally stable, providing soft, pliable post-reflow residues, delivering fewer false rejects during in-circut testing

It eleminates head-in-pillow defects when mounting BGA devices.

Indium8.9’s excellent wetting provides your product’s first-pass yields and reduces field failures.

It provides low-voiding properties: <5% voiding in a multitude of profiles when soldering BGA’s with via-in-pad technology.

Excellent response to pause: optimizing production line operational efficiencies.

Long stencil life: enables long production runs

Provides high component retention tack: reduces component shifting defects.

Indium8.9 allows you to:

• increase your finished goods reliability.
• increase your finished goods first-pass yield.
• increase your manufacturing process efficiencies.
• reduce your average process cycle time by reducing downtime.
• reduce your total cost of usage.
• reduce your process scrap.
• enhance your finished goods performance.
• increase your operational profitability.

Indium8.9: This is BIG!