Andy Mackie’s Flash Biography

Global Product Manager

Semiconductor & Advanced Assembly Materials

Editorial review board CHIP SCALE REVIEW

EXPERTISE:

  • Wafer Fabrication
  • Semiconductor Packaging
  • Electronics Assembly

Assembly and Packaging
Subgroup
ITRS

FLUX TECHNOLOGIES

  • Wafer bumping
  • 2.5D and 3D interconnect
  • Wafer-level chip-scale packaging
  • Package-on-Package (PoP)
  • Epoxy
  • Ball-attach

SOLDER TECHNOLOGIES:

  • Low and ultralow alpha solder pastes
  • PoP solder pastes
  • Wafer & substrate-bumping solder pastes
  • Ormet® transient liquid phase sintering (TLPS) pastes
  • Specialty & micro solder spheres
  • Die-attach solder pastes
  • Die-attach solder wire

Indium Corporation Representative:

  • SEMI
  • JEDEC

Blogger

Andy C. Mackie: You've got full access

amackie@indium.com

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