应用
夹子和导线架连接
In power electronics packaging, clip-attach and lead frame attach are two methods used to bond pre-fabricated copper frames, enabling efficient internal and external interconnections. Clip-attach typically connects the top of the semiconductor die to the substrate, while lead-frame attach extends beyond the package to create external electrical connection terminals. The choice of bonding material is crucial for enhancing yield and overall performance.
概述
Maximize Yields with Indium Corporation’s Portfolio
When choosing materials for clip-attach or lead-frame attach applications, it’s important to consider thermal and electrical conductivity, as well as melting temperature. Different package designs cater to various mission profiles, offering a range of options for these applications. Indium Corporation provides a comprehensive portfolio to meet your needs and enhance yield performance.
益处
Cutting-Edge Solutions from Indium Corporation
高可靠性
Enhance the reliability of your power electronics by choosing the optimal material. Indium Corporation provides solutions ranging from InFORMS® and high-reliability alloys to sintering materials.
无助熔剂焊接
通过使用专门为甲酸回流焊工艺设计的预型件和 InFORMS®，这些无助焊剂焊接系统无需进行回流焊后清洗。
可控粘合线厚度
InFORMS® 增强预型件采用 Indium 的矩阵支承设计，可持续实现最小键合线厚度 (BLT)，防止应力集中在芯片表面，提高焊点可靠性。
广泛的合金选择
Indium Corporation offers a broad range of alloy options—in both Pb-based and Pb-free compositions—suitable for low- and high-temperature melting applications.
相关产品
我们提供各种产品，确保高质量的模块包装。
相关应用
您的成功
是我们的目标
利用最新材料、技术和专业应用支持优化您的流程。一切从与我们的团队联系开始。