Seth Homer: At Indium Corporation, we're redefining how we use solder at the die-attach, DBC to baseplate, and baseplate to heat-sink levels so we can achieve a more reliable IGBT that can perform at increasingly higher standards. If you missed the first three videos in this series, get caught up at indium.com/IGBT.
今天，我们将讨论从底板到散热器层面所面临的挑战。消除电源模块的热量对于确保互连可靠性非常重要。许多热界面材料 (TIM) 在零时表现出良好的性能。然而，随着时间的推移，热循环会对其造成损害，许多锡材料会在活动区域下抽出或烤干，导致热失控和故障。一些石墨基材料可以抵御抽出和烤干，但它们在 Z 方向的导热性能较差，需要更大的 X-Y 几何形状来帮助散热。
Indium Corporation offers a wide range of thermal interface materials that are pump-out, bake-out resistant and have superior Z direction thermal conductivity. For example, our Heat-Spring® is an interface that provides 86 watts per meter K of thermal conductivity using a pressure range of only 35 to 100 PSI. Heat-Spring® metallic thermal interface materials boast superior conductivity, ease of use, and improved performance over time as compared to thermal grease alternatives.
除了金属 TIM 之外，Indium Corporations 还为平面度较差的散热器提供厚度为 150 和 250 微米的 HSMF 可压缩无硅材料。HSMF 可提高性能，实现长寿命可靠性，而且与 Heat-Spring® 一样，不会随着时间的推移而抽空或烤坏。
For more information on these and other materials for baseplate to heat sink, visit indiumstg.wpenginepowered.com/IGBT or, if you have any questions, feel free to contact me directly, [email protected].
节省保存
