金焊剂

Indium Corporation is a leading gold solder innovator for high-temperature and high-reliability applications, such as die-attach and hermetic sealing in medical, aerospace, optoelectronics, automotive, and many other industries.

Gold-based alloys offer strong joints, excellent corrosion and oxidation resistance, and good thermal and electrical transfer at the joint. Our gold solder portfolio includes wire, paste, preforms, and ribbon. They are manufactured with cutting-edge technology to ensure quality as well as push the boundaries of precision.

由铟泰公司提供支持

所有焊料中最高的拉伸强度
卓越的导热性
无铅且符合 RoHS 规范

金焊料概述

何时选择黄金产品

Higher yields and cost per unit make gold a viable option for many applications, even though the initial cost is more than alternative solders. A low oxygen atmosphere may be required if the application is flux free. In some instances, pressure is required to promote strong, void-free reflow on horizontal services.

属性

金焊料具有很强的粘接强度、出色的耐腐蚀性和抗氧化性，并能在钎焊接头处进行可靠的热传递和电传递。

处理选项

可选择的成熟加工方法包括：真空焊接、贴片、回流焊、激光焊接、气相回流焊和手工焊接。

特点

我们提供 320 多种合金解决方案，能够承受高达 1,100°C 的温度。创新的无铅替代品--包括金焊料、烧结、预成型和与新型助焊剂系统集成的先进合金技术--也是我们正在进行的开发工作的一部分。

&GT;280°C

High melting point compatible with subsequent reflow processes.

关键应用

Automotive, RF infrastructure, medical, laser, military, and aerospace applications.

无铅

Lead-free and RoHS compliant.

#可靠性排名第一

Highest tensile strength of any solder.

金基合金

Indium Corporation offers a broad range of gold-based alloy solutions with melting temperatures up to 1,064°C:

合金名称	组成	熔点
^{Indalloy®182}	80Au20Sn	280°C 共晶
^{Indalloy®200}	100Au	1,064°C Eutectic
^{Indalloy®178}	82Au18In	固态 451°C / 液态 485°C
^{Indalloy®184}	96.8Au3.2Si	363°C 共晶
^{Indalloy®183}	88Au12Ge	356°C 共晶
^{Indalloy®270}	75Au25Sn	固态 278°C / 液态 332°C
^{Indalloy®269}	78Au22Sn	固态 278°C / 液态 301°C
^{Indalloy®271}	79Au21Sn	固态 278°C / 液态 289°C