产品
烧结材料
Sintering in electronics assembly, is a bonding technique where high melting temperature metals such as silver or copper are used to form highly reliable interconnects with superior thermal and electrical conductivity. Sintering is a process of steady-state interdiffusion, the metal particles fuse together and fuse with the surfaces being bonded once sufficient heat is applied. Sintering can be performed pressure-less or with applied pressure. Indium Corporation offers both silver and copper sinter pastes for both pressure and pressureless processes.
由铟泰公司提供支持
- 有压和无压配方
- 纯烧结材料（无环氧树脂或聚合物）
- 高金属、低有机物方法
烧结产品
Indium Corporation provides a range of sinter pastes tailored for various applications. The InFORCE® series is optimized for pressure sintering, while the InBAKE™ series is ideal for traditional pressureless sintering. For fast, small-area sintering, the QuickSinter® series delivers exceptional performance, ensuring rapid and efficient results.
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