Features & Benefits
Indium Corporation’s soldering materials for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications have a PROVEN track record with more than 2 billion SiP front-end module (FEM) SiP devices manufactured in the last 3 years using Indium Corporation materials.
Dispensable Fine-Pitch Solder Paste
- No-clean and ultra-low residue no-clean
- Type 4, 5, 6