Heterogeneous & SiP Assembly

Heterogeneous & SiP Assembly

From water-soluble to no-clean soldering solutions, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch HIA and SiP applications.

Features & Benefits

Indium Corporation’s soldering materials for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications have a PROVEN track record with more than 2 billion SiP front-end module (FEM) SiP devices manufactured in the last 3 years using Indium Corporation materials.

System-in-Package

Wafer Level Ball-Attach Flux

  • Water-soluble
  • Halogen-free

Ultrafine-Pitch Solder Paste

  • Water-soluble, ultra-low residue, and standard no-clean
  • Halogen-free
  • Type 6, 7

Lidded MEMS

Dispensable Fine-Pitch Solder Paste

  • No-clean and ultra-low residue no-clean
  • Halogen-free
  • Type 4, 5, 6