
Technical Support Engineer
Indium Corporation
Phone: +1 (315) 853-4900
E-mail: msloan@indium.com
Address: 34 Robinson Rd., Clinton, NY USA 13323
Indium Corporation
Phone: +1 (315) 853-4900
E-mail: msloan@indium.com
Address: 34 Robinson Rd., Clinton, NY USA 13323
Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpage and die tilt.
This is the second in a series of posts about semiconductor fluxes, and talks about the optimal dipping depth for flip-chip fluxes.
If you are a little intimidated by semiconductor products, this blog post provides a simple explanation to help you better understand these products.
From One Engineer to Another®
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