IMS 2022!
The International Microwave Symposium (IMS) (June 21-23) is the premier annual international meeting for technologists involved in all aspec...
The International Microwave Symposium (IMS) (June 21-23) is the premier annual international meeting for technologists involved in all aspec...
Folks, In my last post, I shared about an Excel®-based software tool called Line Balancer™ to help candidates for SMTA Certification prepare...
The tomorrow of yesterday is here today. At the start of this year, registered electric vehicletos (EVs) on global highways totaled just over 10 milli...
Folks, I recently developed some Excel®-based software to help those who are planning to take the SMTA certification exam to practice. Software to...
Folks, some years ago I created a software tool, StencilCoach™, to calculate the stencil parameters to provide for an adequate amount of so...
SIR testing has been around for a while. Why? And why might we want to use tests that are even more challenging than the current J-STD-004B?...
AuLTRA™ 3.2 and AuLTRA™ 5.1 are air or nitrogen reflow AuSn solder pastes specially formulated for higher processing temperatures and asse...
Reflow oven profiling can be your most powerful process validation and verification tool. It can be simplified as to not be a dreaded task to be skipp...
Folks, Over ten years ago, I created the characters Patty and The Professor. The intent was to tell SMT assembly process improvement stories through t...
Some thoughts on how a solder supplier can help make the next step of the manufacturing process a little bit greener. ...
Folks, One of the great advantages of being a professor at Dartmouth College is working with the world’s best young students. However, Emily Dea...
Beware of offset die, i.e. a thermal slug not centered in the device body but offset to the side. and too little solder paste deposited on thermal slu...