Mixed Alloy Wetting for SAC BGA Assembly Using Sn63 Solder Paste
Have you ever wondered about what happens to a Pb-free Ball-Grid Array (BGA), with Tin/Silver/Copper (SAC) spheres in a Tin/Lead (Sn/Pb) proces...
Have you ever wondered about what happens to a Pb-free Ball-Grid Array (BGA), with Tin/Silver/Copper (SAC) spheres in a Tin/Lead (Sn/Pb) proces...
Folks, I just finished teaching a new class (for me) The Technology of Everyday Things at Dartmouth. This class fills a lab and technology...
After transferring flux, align the stencil Setup print parameters to minimize doubles and......
Don’t’ expect a simple answer – that depends on your application. span......
A recent interview with Andy Mackie,(Ph.D., Indium Corporation)in Advanced Packaging Magazine helped shed some light......
Have you ever had a hard time getting help with something? For the last year I’ve been searching......
The picture shown to the right is the wall of my office. “Why would Jim have spigots on......
Following the success of NC-506 (No-Clean flux for mounting spheres on BGA packages) is a halogen-free version – NC-585.span......
If you have been hoping that you current BGA process doesn’t fall victim to non-wets, it’s time to gain......
I recently visited a customer to help optimize a flux-less indium soldering application. They admitted they needed flux but didn’t......
This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way......