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Before the Device Packaging Conference

  • Indium Corporation

  • The IMAPS Device Packaging Conference is quickly approaching, it’s less than a week away! If I had to pick one conference to go to per year, it would be this one.

    With up to four presentations going on at any given time, now is a good time to start planning which sessions you want to attend. The conference divides its attention into 5 catagories: 3D packaging, flip chip, biomedical, MEMS, and wafer level / chip scale packaging.

    I look forward to seeing you all there.