Posted On: August 3rd, 2017 | By: Karthik Vijay

Inert Atmosphere

Soldering without flux is generally regarded as difficult if not impossible. Yet a fluxless process is routinely done with 80Au/Sn ribbon and preforms...

Posted On: August 1st, 2017 | By: Karthik Vijay

Au/Sn – Different Solder Forms

Au/Sn is available in all the forms you would expect from conventional solder alloys. ...

Posted On: July 26th, 2017 | By: Phil Zarrow & Indium Corporation®

Test Methods for ECM Assessment & Process Control: Basics of ECM

Brook Sandy-Smith and Phil Zarrow introduce a four-part series on electrochemical migration (ECM) assessment and process control...

Posted On: July 24th, 2017 | By: Phil Zarrow & Indium Corporation®

Test Methods for ECM Assessment & Process Control: Test Methodologies & Process Control

Brook Sandy-Smith and Phil Zarrow define the meaning behind each character in a flux classification ...

Posted On: July 24th, 2017 | By: Phil Zarrow & Indium Corporation®

Test Methods for ECM Assessment & Process Control: Process Considerations for Flux Reliability

Brook Sandy-Smith and Phil Zarrow discuss leftover flux residue's contribution to electrochemical migration ...

Posted On: July 24th, 2017 | By: Phil Zarrow & Indium Corporation®

Test Methods for ECM Assessment & Process Control: Sources of Contamination

Brook Sandy-Smith and Phil Zarrow explore several sources of contamination ...

Posted On: June 20th, 2017 | By: Phil Zarrow

Importance of Profiling a Reflow Oven

Trying to select and develop the proper reflow profile? This video explores the differences between the three main profile types. ...

Posted On: February 21st, 2017 | By: Eric Bastow

Project 99 Wave Solder Flux Performance Proof: SIR Testing

Surface Insulation Resistance (SIR) tests measure the post soldering effect on the electrical integrity of the circuit boards. This post explores the ...