J-STD-004 Halide Test Requirements Update
The IPC J-STD-004 committee met at APEX last month. They are planning on releasing an updated specification. One positive change that is being made ...
The IPC J-STD-004 committee met at APEX last month. They are planning on releasing an updated specification. One positive change that is being made ...
Due to the limitations of flux, there is bottom end temperature where traditional solder/flux bonding ends. The lowest temperature I have experienced ...
Okay, this has no use for semiconductor packaging that I know of, but it is a neat trick that I discovered in the lab a couple days ago. ......
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
Head-in-pillow defects related to solder paste or flux performance are classified as Materials Issues. These include poor transfer efficiency on stand...
With only 24 hours to answer a customer regarding a strange flux / alloy / surface finish / temperature compatibility, we had no time to have an exoti...
Corrosion is caused by an electrochemical reaction between two dissimilar metals, one acting as an anode – one as a cathode. Halide ions, such a...
Head-in-pillow defects caused by on-line processing issues are categorized under Process Issues. These include printing, placement and reflow. Printin...
I know it’s been a while since my last post, but we’ve been so busy. In fact, one such incident was yesterday. One of our VP’s came....
Have you ever had to hand-place solder washer preforms on the pins of a connector and found it to be very labor intensive? Indium Corporation has a pr...
A recent topic which has come up in the soldering world has been the push for halogen-free or halide-free fluxes. There are many reasons customers are...
If you are new to Package-on-Package solder paste, expect the material to be lower viscosity then you are used to for printing or even dispensing appl...