To the Windy City and Back Again
This is an account of my trip to Indium’s Chicago facility. If you didn’t get a chance to read my previous post, the link is right he...
Flux
SMT Optimization For Success - Part 6: The Effect of Solder Particle Size on Printing Using Ultrafine Stencil Apertures
SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post...
Partially Cleaning No-Clean Solder Paste - the Godzilla effect
The other day I was watching the classic film “King Kong vs Godzilla” with my son. At one point, I believe related to some prequel t...
How to Evaluate a Wave Solder Flux
The title of this blog is a little misleading because it is actually going to focus on an inappropriate method that is sometimes used in wav...
Pin-in-Paste Aperture Solder Volume Calculations with StencilCoach(TM)
Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of thr...
Ultralow Residue Flip-Chip Fluxes: Semicon Taiwan
It’s often helpful to overhear good things being said about you. I attended a supplier meeting in Los Angeles in March, and overheard two senior...
SMT Optimization for Success Part 3: Flux Chemistry
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the t...
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Residues
At APEX 2014, I presented a paper about the effect that reflow profiling has on the SIR (Surface Insulation Resistance) performance (electrical reliab...
Stencil Printing for Success: Solder Paste Handling and Storage
SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the ste...
Square Solder Wire - A New "Twist" on an Old Product?????
Round solder wire, especially flux-cored, has been a mainstay of the electronics industry ever since electronics came into existence. Round solde...
High Reliability Solder Preform Flux Coating for the Telecom Industry
The telecom industry relies heavily on Telcordia (Bellcore) testing to determine the electrical reliability of no-clean solder flux residues. There ar...
What a J-STD-004 classification of "OR" means and what it doesn't mean
Most SMT fluxes and solder pastes are either classified as RO or OR. Every once in a while one will see an occasional RE flux. People typically recogn...