Alloy Melting
Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our...
Gold Solder
Specifying Solder Preforms - The Perfect Alloy
I’ve always been a strong believer that a customer should not get a solder alloy that just “works” for their application, they shoul...
An Interveiw with Bob Bormann of Standard Printed Circuits
This year I had the pleasure of working with a circuit board company in Central New York called Standard Printed Circuits, Inc. From personal experien...
IMAPS 2013: International Symposium on Microelectronics
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending b...
Wet Gold: A Technique to Measure Density Without Knowing the Volume
Folks, In the category of interesting requests, Ron, a gold worker, from Guyana, sent me the following note: Dr. Ron, My colleagues use a “...
Indium: HIgh Technology Metal
There have been a variety of people who were key to the development of indium metal in general, and Indium Corporation in particular, over the ye...
Variables in the Package-on-Package Process
When designing a Package-on-Package (PoP) assembly process, there are many variables that need to be considered in order to be successful. While...
Choosing the Best Metallization for your NanoBond® Application
Since the NanoBond® process is almost instantaneous, fluxes are not used. (They just don’t have enough time to heat up to their activation t...
Preparing Surfaces for a NanoBond®
The first time I was taught how to solder (as a child), I was told: “All the surfaces need to be mechanically cleaned and chemically cleaned.&rd...
Adding Solder to a NanoBond® Assembly
One of the biggest misconceptions about NanoFoil® is that it is a form of solder. While it may contain a solder coating if specified (usually tin)...