Why is AuSn powder size important for solder paste application?
Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. Thi...
Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. Thi...
We’re featuring our Au solder product line and braze materials at the High-Temperature Electronics Network (HiTEN 2019) at St. Anne’s Coll...
Why is Indium Corporation excited to be exhibiting at the International Microwave Symposium in Boston, MA?...
Visit us at SPIE West show at booth #3310 on February 5-7. We look forward to learning more about your applications. ...
Dr. Ron received a question asking him to verify a calculation used to determine the karat value of various gold-based alloys. It's not as si...
Performing die-attach using AuSn solder alloy preforms against gold plating? You may need an off-eutectic solder alloy to compensate for the Au that i...
For some reason, I find the combination of gold and indium incredibly interesting. This shouldn’t come as a surprise; I caught gold fever pannin...
80Au20Sn solder preforms transfer heat from the active layer in laser diodes, creating a strong bond for long-term reliability. ...
Typically, applications that use gold-tin solders are structural or die-attach. Structural applications make use of the alloy’s high strength, w...
80Au20Sn solder paste and preforms both have particular attributes that make them ideal for certain bonding applications. We take a look at how your p...
Gold-based solder alloys have superior strength and conductivity; perfect for applications requiring a high temperature, reliable bond that can hold u...
Summary: Gold solder alloys are valuable due to their unique range of reflow temperatures and their resistance to corrosion, making them ideal for hig...