Step 2 to Consider When Designing a Trouble-Free Solder Joint
Once you have an understanding of the type of solder needed for an application, (a hard solder such as AuSn for reflow temperatures above 125&d...
Once you have an understanding of the type of solder needed for an application, (a hard solder such as AuSn for reflow temperatures above 125&d...
A new tutorial on assembling package-on-package components is available. Click here for the PoP Guide and other application......
Soldering to copper has been around since the beginning of soldering itself. Copper wiring and copper pipes are where soldering began, and copper is s...
Soldering just plain copper has gone away. Now, there are many different surface finishes that we, as an industry, solder to. This includes Organic So...
Just because a Design Of Experiment (DOE) doesn’t turn out the way it was conceived, that doesn’t mean it......
“Listen to my Tin Cry!” We have a feeling that a superhero made out of indium......
From a mechanical perspective, larger solder joints are generally preferred when assembling package-on-package (PoP) components. Just as ...
Heat generation in a power chip. Chip can be cooled by a careful selection of solder TIM and heat sink. ......
Sometimes a new process goes against everything we know will work. Those applications are few, but revolutionary.span style="mso-spacerun:....
Pure indium or indium alloys are used to form hermetic seals that also conduct heat. Indium washers......
Some people do underfill PoP components with capillary underfill. This is done in one application step, there is no distinction between underfil...
The most common metal thermal interface materials are made from indium alloys which melt between 100C to 200C. Some power devices I have come across d...