To the Windy City and Back Again
This is an account of my trip to Indium’s Chicago facility. If you didn’t get a chance to read my previous post, the link is right he...
This is an account of my trip to Indium’s Chicago facility. If you didn’t get a chance to read my previous post, the link is right he...
This title is appropriate because I am going to one of Indium Corporation’s solder manufacturing facilities, in Chicago, and because it is the s...
The Indium Corporation recently had a customer contact us looking for 50In50Pb solder wire. We manufacture large amounts of this indium-lead mat...
SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post...
The plane landed, I got my bags, and I drove home. What a great show. The SMTA International show took place September 28 to October 2 this year in Ro...
Folks, The pin-in-paste (PIP) process is often the best choice when the PCBA is a mixed SMT and through-hole board with a small number of thr...
SMTA International (SMTAI) will be held in Rosemont, Illinois, September 30 through October 1, 2014. I am very excited about the show as I am e...
It’s often helpful to overhear good things being said about you. I attended a supplier meeting in Los Angeles in March, and overheard two senior...
Folks, A while ago, I developed an Excel-based spreadsheet, StencilCoach™, that calculates optimal stencil aperture parameters for several commo...
There is a lot of interest in plating indium bumps and other fine features onto wafers and other substrates. And the desired bump size and pitch ...
Folks, It surprises many people that the foundation metal of almost all solder alloys is tin. Alloy elements such as lead, silver, copper, indi...
New developments are happening almost daily in the electronics device world: phones that do much more than just convey voice, clothing that monitors a...