2013 SVC Presentation: Eliminating the Bond Stress of Sputtering Targets at Operational Temperatures
I invite you to come to the Emerging Technology session of the SVC (Society of Vacuum Coaters) Conference on Wednesday April 24th – where I&rsqu...
I invite you to come to the Emerging Technology session of the SVC (Society of Vacuum Coaters) Conference on Wednesday April 24th – where I&rsqu...
The 2013 IPC APEX Expo , the premiere electronics assembly event, is right around the corner – and our technology experts are ready to share the...
There have been a variety of people who were key to the development of indium metal in general, and Indium Corporation in particular, over the ye...
Today I thought I’d take a break from talking about soldering materials for a minute to reflect on how we arrived at Blog Post #415. Back......
A few years back, Indium Corporation’s own Eric Bastow set up a prototype NanoFoil® plating process to demonstrate the material and......
You’d imagine that a material which can reach 1,500°C instantly should be treated with caution, and it should, but NanoFoil® is a lot sa...
NanoFoil® is as simple as elemental nickel and aluminum, with small amounts of vanadium, indium, copper, and silver. Due to the benign nature of ...
NanoFoil® has many uses, and, sometimes, it has more than one function in an application. For instance, if tin coated NanoFoil® is......
One question that I often hear from customers is; “Once out of the refrigerator, how long do I have to wait to allow my solder paste and/or flux...
When designing a Package-on-Package (PoP) assembly process, there are many variables that need to be considered in order to be successful. While...
We’ve heard about the solder paste “graping” defect, but the same oxidation challenge occurs in other solder forms as well, such as ...
InCuSil™ is a common term for an alloy of indium, copper, and silver which (depending on composition) has various melting points in the brazing ...