Package-on-Package Process; an interview with Jim Hisert
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
Head-in-pillow defects related to solder paste or flux performance are classified as Materials Issues. These include poor transfer efficiency on stand...
As many other companies are “going green” so can you with the right thermal interface material. Are you using indium materials now and col...
Head-in-pillow defects caused by on-line processing issues are categorized under Process Issues. These include printing, placement and reflow. Printin...
Head-in-pillow defects caused by everything before the components go on-line can be grouped into Supply Issues. Some specific issues within this group...
I know it’s been a while since my last post, but we’ve been so busy. In fact, one such incident was yesterday. One of our VP’s came....
Have you ever had to hand-place solder washer preforms on the pins of a connector and found it to be very labor intensive? Indium Corporation has a pr...
A recent topic which has come up in the soldering world has been the push for halogen-free or halide-free fluxes. There are many reasons customers are...
More information, please visit: www.indiumchina.cn/big www.indium.com/big ......
I recently read an article at Development Monkey by Karen Field about how Development Kits are growing in popularity with Design Engineers. She report...