This stencil/screen design was carried out by Jeff Schake of DEK International. Sorry for the blurry detail - it references the aperture design for each pattern across the tool.
During the International Wafer-Level Packaging Conference, we will be explaining advantages of printing stencils and screens for depositing flux through sub-150µm diameter apertures. You’ll also get a chance to learn about the optimization of squeegee blades, print pressure, print speed, and snap-off distances and separation speeds.