AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Reflow Profile
In a previous blog I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram.&nbs...
In a previous blog I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram.&nbs...
On April 14th, iNEMI will host two webinars for the purpose of discussing a new project geared toward High Temperature, Pb-free Die Attach Materials....
Here’s a true story regarding the service temperature of solder joints. Yesterday, as I left work, I noticed that it felt really hot outside. I ...
In today’s electronics manufacturing industry, many companies are using lead-free solder alloys. However, there are a few sectors in the industr...
Folks, It is hard to believe that in July we will celebrate the 9th anniversary of the advent of RoHS. So the timing seemed right when I was recently ...
After a delightful lunch with Rob, Pete, and the Professor, Patty settled into her office to prepare a lecture on statistics. She was still enjo...
Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our...
Once an order is placed for the solder preforms that you have specified, Indium Corporation begins the manufacturing process promptly; we have a lot o...
Patty was just getting ready to leave her office for a bi-weekly luncheon with the Professor, Pete, and Rob. They had regular meetings like this...
If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders...
Spray Fluxing is the most common way to flux a printed circuit board today. When spray fluxers were first developed they were clumsy, inefficient......
When the wave soldering machine was developed, the early flux application method was the same as the solder application method – a wave. While t...