Indium Blog

Semiconductor Packaging Materials - Find What You're Looking For

  • Are you looking for information on semiconductor packaging materials?  Send your request to  It’s all fair game – released, experimental, or competitor materials.  Flux characteristics, paste properties, application methods…






    Inquire about any of the following topics:



    • Pin transfer


    • Package-on-Package (PoP)


    • Solder spheres


    • Glass transition temperatures (Tg)


    • Flip chip assembly


    • BGA rework


    • Cross-sectioning electronic components


    • Paste for component dipping


    • Solder alloys


    • Liquid fluxes


    • Wafer bumping


    • Low alpha solder


    • Spin coating


    • Redistribution layers (rdl)


    • Halogen-free


    • Flux viscosity


    • Solder paste viscosity


    • Whatever else you are interested in


Authored by previous Indium Application Manager Jim Hisert