Semiconductor Packaging Materials - Find What You're Looking For

• Are you looking for information on semiconductor packaging materials?  Send your request to jhisert@indium.com.  It’s all fair game – released, experimental, or competitor materials.  Flux characteristics, paste properties, application methods…

   

   

   

   

   

  Inquire about any of the following topics:

   

   

  • Pin transfer

     

  • Package-on-Package (PoP)

     

  • Solder spheres

     

  • Glass transition temperatures (Tg)

     

  • Flip chip assembly

     

  • BGA rework

     

  • Cross-sectioning electronic components

     

  • Paste for component dipping

     

  • Solder alloys

     

  • Liquid fluxes

     

  • Wafer bumping

     

  • Low alpha solder

     

  • Spin coating

     

  • Redistribution layers (rdl)

     

  • Halogen-free

     

  • Flux viscosity

     

  • Solder paste viscosity

     

  • Whatever else you are interested in

     

Authored by previous Indium Application Manager Jim Hisert