锡膏和底部填充剂的兼容性 (Solder Paste Compatiblity with Underfill in SMT)
在SMT中，底部填充剂(underfill) 常常被用在BGA/QPN 的组装...
SMT Solder
Void Reduction in Solder Joints
It is often said that a chain is only as strong as it weakest link, the same can be true for a series of......
Military/Aerospace Lead-Free Solder Reliability Still Unproven
Folks, I’m taking a few moments from Wassail Weekend , held annually in my village, Woodstock VT, “The prettiest small town in Americ...
Tombstoning: The Death of a PCBA
Tombstoning (also known as the Manhattan effect, drawbridge effect, or Stonehenge effect) is described (in the simplest, and most common, sense) as oc...
Solder Paste and Flux Dip Depth: II
Following on from our discussions of last time... As you will recall from the previous post on this topic, My friend and colleague Chris Nash and I w...
Solder Paste and Flux Dip Depth: I
My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-pac...
QFN Reliability in SMT Electronics Assembly
Folks, Let’s look in on Rob: Rob looked at the new photo of Patty and their twin sons Peter and Michael. What a handful those two 18 month-...
Soldering: an Indian Engineer's Perspective!
Hi there! I am excited, this is my first blog post -ever. I am excited that it is a technical blog of Indium Corporation. My story is very ...
Tin and Silver Use in Electronics after RoHS
Folks, In a recent posting we discussed that the higher melting temperatures of lead-free solder require reflow soldering temperatures to be higher, t...
Increased Use of Electricity for Lead-Free Soldering Assembly & High-Melt Lead-Free Solders
Folks, An obvious disadvantage of lead-free electronics soldering assembly is that the oven must be hotter and therefore will use more electricity (ve...
A New Low-Temperature Metallization Paste For Interconnecting Thin-Film Solar Cells
Last week I spent some time in the Advanced Materials and Process Development Lab with Eric Bastow, verifying the printing characteristics of our newe...
Thermocompression Bonding for Microbump Flip-Chip Soldering
For reasons that I will discuss in a post later this year, a common factor that is emerging in the area of copper-pillar microbump 2.5D and 3D jo...