Weibull Analysis of Solder Joint Failure Data II
Derivation of the Weibull Graph Folks, Last time we introduced Weibull analysis. Let’s now derive the relationships needed to calculate the slop...
Derivation of the Weibull Graph Folks, Last time we introduced Weibull analysis. Let’s now derive the relationships needed to calculate the slop...
It is hard to believe, but 50 years ago, on October 9th, the first visible light LED was demonstrated by Nick Holonyak, Jr. of GE Advanced......
The first time I was taught how to solder (as a child), I was told: “All the surfaces need to be mechanically cleaned and chemically cleaned.&rd...
The first step of the NanoBond® process should usually happen long before the NanoFoil® arrives at your facility. DFM (design for manufacturin...
While on a recent trip to Malaysia, I interviewed two colleagues regarding trends in semiconductor assembly. My previously-published interview with Sz...
One of the biggest misconceptions about NanoFoil® is that it is a form of solder. While it may contain a solder coating if specified (usually tin)...
Ultrasonic Testing (UT), performed by acoustic microscopy, is a great way to determine the quality of a solder bond without destroying the assembly. ...
To successfully use NanoFoil®, you do not need to fully understand what it is or how it is made, although that does help. It also makes for a...
When helping customers with the optimization of their soldering process, the question often comes up; “What will my solder bond line thickn...
Here is a picture of an Indium Corporation solder flux pen, sectioned to show you the internals. Who DOESN’T want to see THAT, right?!? Fl...
The Indium Corporation has developed a new solder research kit designed specifically to meet the needs of medical manufacturers who are soldering to N...
About a month ago I posted about the various 3D technologies (chip creation, packaging and printed circuit boards) that are being used to op...